QFN20 3.5x3.5mm Gold-Plated Aging Test Socket for 20L DFN Chip Burn-in

This product is a high-quality socket designed for the aging and burn-in testing of 20-lead DFN chips. It features a durable gold-plated finish for enhanced conductivity and reliability during testing. With dimensions of 3.5x3.5mm, this test socket is compact, ensuring precise alignment and secure holding of the chip during operations. Ideal for engineering and quality control applications, it allows for repeated use, offering a reliable solution for chip testing and longevity assessments. Part Number: QFN20 Type: Integrated Circuit (IC) Manufacture country: China Instructions included: No