4pcs 50mm Heatsink 50mm x 50mm x 11mm Heatsink Aluminum Cooler Cooling Peltier Plate Module Router Amplifier Chip CPU Power Transistor FET IC Led

1. Heatsink size: 50mmx50mmx11mm; Weight: 33gram per, 22x10 fins per 2. Comes with heat conductive tape, easy to install, excellent heat dissipation effect 3. 6063-T5 aluminum and anodized heatsink, not easy to scratch, fins not easy to bend, groove design increases heat dissipation area and accelerates heat dissipation. 4. This large large aluminum heat sink widely used for computers, power transistors, FETs, ICs, power amplifiers, voltage regulators, MOSFETs, SCRs etc. 5. Contains 4 heat sinks 22x10 PCS Cooling Fins Material 50mm heatsink anodized aluminum Color: Sliver Dimensions: 50x50x11mm (L*W*H) Package: 50mm heatsink x 4 pieces Weight: 33g/pcs Made of high quality aluminum, good thermal conductivity Reduces the risk of hardware failure due to overheating Maximizes surface area Cooling air.The 220 Increases the area of the board that is designed to be in contact with the PCS fins, thus providing greater heat transfer. This 50mm heatsink kit is suitable for various cooling applications such as electronic, computer and electrical equipment, provides cooling effect, and is suitable for passive cooling such as LED high power electronics voltage regulators. Easy to install and can be used with other devices to cool processors, regulators, etc. Widely used in computers, power transistors, FETs, ICs, power amplifiers, voltage regulators, MOSFETs, SCRs, etc. Please make sure the heatsink size fits your part. 4 pieces 50mm Heat Sink Kit 50x50x11mm Aluminum Heat Sink Heat Sink Groove Pattern 1. Increased Heat Dissipation Area: Grooves greatly increase the surface area of the heat sink, providing more contact points for heat transfer. This increased heat dissipation area increases cooling capacity and allows for faster heat dissipation. 2. Enhanced heat dissipation: Grooves improve airflow and turbulence around the heat sink. When air passes through this groove, it disrupts the laminar flow, increases heat transfer efficiency, and accelerates the heat dissipation process.