Professional Design Foxconn CPU Socket Chip Socket Socket Big Tin Ball

Product description: 1.Color of the commodity: as the picture shown 2.Material of the commodity: Metal 3.Size of the commodity: 1150/1151/1156 Type: 1150:Foxconn CPU socket patch socket socket 1151 :Foxconn CPU socket patch socket socket 1156 :Foxconn CPU socket patch socket socket Supply Voltage: International standard Dissipation Power: International standard Operating Temperature: International standard Package includes: 1PC Important Notice

The BGA chips you buy from our company are of high technology and as precise as nanometer. For small quantity of chips, they are exposed to the air after being taken out from package. So they probably will adhere to some humidity. Thus, in order to avoid quality problem, we suggest that you put them inside a baking chamber for at least 24 hours at 100Celsius -110Celsius .

When soldering, please control the temprature precisely. Lead-Free/No Pb BGA chips is 245Celsius -260Celsius (Maximum) Leaded/Pb BGA chips 180Celsius -205Celsius (Maximum).

The soldering process is complicated. Soldering/replacing chips must be operated by engineers who have proficient skills. As BGA chips are fragile, complicatedly structured, with numerous balls, any slightly faulty positioning, careless temperature-control, or incomplete cleaning PCB boards will result in insufficient soldering or missing soldering. The chips will, as a result, die. BGA chips are easily get broken by improper soldering.

Package Contents: 1 Pc

Caution: 1. Due to manual measurement, please allow 0.1-0.5 inch difference, thank you.

2. Please understand that due to the difference in light exposure or computer display, the color of the item may be slightly different from the picture.