WYLIE Thermal Gel Pad High Performance Non Curing Thermal Conductive Pad Fast Heat Dissipation for Phone CPU Chip Cooling Repair

Name: WYLIE Thermal Gel Pad High Performance Non Curing Thermal Conductive Pad Fast Heat Dissipation for Phone CPU Chip Cooling Repair
SKU: 6a3e6959cd17cf01fdfc5e02
Price: 123.7 RON
Availability: InStock

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De la Preț 123,70 RON

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Descriere

High-concerned chemical : None Material : Other Packing Pattern : Other Model Number : WYLIE Ice core-thermal gel Origin : Mainland China Type : Liquid Glue Brand : WYLIE Features1 : Good thermal conductivity Features2 : High insulation and non-corrosive Features3 : Strong plasticity and peelability Features4 : Detachable and reusable Features5 : Low hardness, remains non-drying for extended periods Features6 : Thickness can be compressed to 0.1mm

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