XINZHIZAO L2023 Heating Platform Layering Lamination Tin planting Lattice iP X-15PM A8-16 CPU FACE ID motherboard separation

Name: XINZHIZAO L2023 Heating Platform Layering Lamination Tin planting Lattice iP X-15PM A8-16 CPU FACE ID motherboard separation
SKU: 65fc72f18af8fc01eeda879e
Price: 3071 CZK
Availability: InStock

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Plánované doručení 6‑12 pracovních dnů

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Size：110V-220V Package：BAG Model Number：XINZHIZAO L2023 preheating desoldering station Application：Motherboard Layered/IC Chip BGA Stencil DIY Supplies：ELECTRICAL Type：Intelligent Desoldering Platform Brand Name：PHONEFIX Origin：Mainland China Item：BGA Reballing pre-heating platform Feature：Positioning platform Feature 2：High precision and precise alignment Support：For Iphone X-14 Pro Max Style：intelligent preheating platform

Size: 110V-220V Package: BAG Model Number: XINZHIZAO L2023 preheating desoldering station Application: Motherboard Layered/IC Chip BGA Stencil DIY Supplies: ELECTRICAL Type: Intelligent Desoldering Platform Brand Name: PHONEFIX Origin: Mainland China Item: BGA Reballing pre-heating platform Feature: Positioning platform Feature 2: High precision and precise alignment Support: For Iphone X-14 Pro Max Style: intelligent preheating platform

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