BGA Reballing Stencil Template Steel Rounded Rectangle Hole for IOS Cell Phone CPU Tin Plant

Feature: 1. FAST AND ACCURATE: Possess fast tin planting speed, ball template will not change at high temperature, with accurate positioning 2. NO TIN STICKING OR BROKEN CORNERS: Using half cut process, there are many IC groove on the main body of the stencil, which can effectively prevent small ICs from sticking to tin and protect small ICs from breaking corners 3. COMPACT AND PORTABLE: BGA reballing stencil come with compact appearance, portable, easy to use and long lasting 4. APPLICABLE MODEL: Applicable CPU for A11, applicable product models for IPX, for IP 8, and for IP8P 5. CORROSION RESISTANT STAINLESS STEEL: Stainless steel material mesh possess corrosion resistance, good mechanical properties, high strength Specification: Item Type: BGA Reballing Stencil Product Material: Stainless steel Spacing: 0.12mm Applicable CPU: For A11 Adaptation Product Models: For IPX, for IP 8, and for IP8P. Package List: 1 x BGA Reballing StencilFAST AND ACCURATE: Possess fast tin planting speed, ball template will not change at high temperature, with accurate positioning NO TIN STICKING OR BROKEN CORNERS: Using half cut process, there are many IC groove on the main body of the stencil, which can effectively prevent small ICs from sticking to tin and protect small ICs from breaking corners COMPACT AND PORTABLE: BGA reballing stencil come with compact appearance, portable, easy to use and long lasting APPLICABLE MODEL: Applicable CPU for A11, applicable product models for IPX, for IP 8, and for IP8P CORROSION RESISTANT STAINLESS STEEL: Stainless steel material mesh possess corrosion resistance, good mechanical properties, high strength